Huain Wired Conference Discussion HY-6210CPR:

DSP/DDOV technology
– Advanced and stable ?IRIN? chip, DSP/DDOV digital conference technology, digital signal transmission and processing;
Intelligent audio detection
Dual backup design
– Extendable to support hand in hand meeting and phantom power dual system audio signal output at the same time, can double guarantee audio signal;
Pickup Stencil Design
– Zinc-aluminum alloy microphone pole, unique cavity and one-piece pickup stencil design, can accurately control the pickup angle, to avoid acoustic feedback and whistling, to support the dual-pickup head lateral array technology;
Zinc alloy body
– All zinc alloy body, base finishing one-piece molding, anodic oxidation process;
Multiple connection methods
– Support one-line, splitter box, T-head and ring handrail and other connection methods, comes with a professional 8-core or CAT5 cable, the wire using the whole line of aluminum foil, water line shielding, can effectively avoid and prevent line electromagnetic interference;